As an electronic display device, full color LED displays are the same as ordinary electronic devices, and the product performance is affected by changes in external environmental factors. These complex and changeable environmental factors are not fatal to the full color LED display, but they will also affect the normal service life of the display.
The failure rate of any product is very low during its service life and only under suitable working conditions. As an integrated electronic product, the LED screen on the building is mainly composed of a control board with electronic components, switching power supplies, light-emitting devices, etc. The composition and the service life of all these are closely related to the operating temperature. If the actual working temperature exceeds the specified use range of the product, not only the life span will be shortened, but the product itself will also be severely damaged.
In order to maximize the average lifespan of a LED screen on building, the threat from dust cannot be ignored. In a dusty environment, the printed board absorbs dust, and the deposition of dust will affect the heat dissipation of the electronic components, which will cause the temperature of the components to rise, and then the thermal stability will decrease or even cause electric leakage, which will lead to burns in severe cases. In addition, dust can also absorb moisture, corrode electronic circuits, and cause short-circuit failure. Although the volume of dust is small, the harm to the product cannot be underestimated. Therefore, it is necessary to clean up regularly to reduce the probability of failure. When cleaning the dust inside the display, remember to disconnect the power supply and operate carefully and safely.
Although almost all displays can work normally in an environment with a humidity of 95%, humidity is still another important factor affecting product life. The moist gas will enter the IC device through the packaging material and the joint surface of the components, causing the internal circuit to oxidize and corrode the circuit, and the high temperature during the assembly welding process will cause the moist gas entering the IC to heat and expand and generate pressure, which will cause the separation of plastic (delamination) from the inside of chip or lead frame, wire bonding damage, chip damage, internal cracks and cracks extending to the surface of the component, and even component swelling and bursting, also known as "popcorn", which will cause assembly parts to be repaired or even scrapped. More importantly, those invisible and potential defects will be incorporated into the product, causing problems in the reliability of the product. Reliability improvement methods in humid environments include the use of moisture-proof materials, dehumidifiers, and protective coating covers.
Humidity and salty air environment can cause the degradation of system performance because they will aggravate the corrosion effect of metal parts, but also are beneficial to the production of primary batteries, especially when different types of metals are in contact. Another harmful effect of moisture and salty air is the formation of a film on the surface of non-metallic parts that causes the insulation and dielectric properties of these materials to deteriorate, thereby forming a leakage passage. Moisture absorption by insulating materials can also increase the volume conductivity and dissipation factor of the material. Reliability improvement methods for humid and salty air environments include the use of air-tight seals, moisture-proof materials, dehumidifiers, protective coatings/covers, and reduction of the use of different types of metals.
The interference of radiofrequency radiation on electronic systems generally comes from two sources. One way is that the electrical noise interference of the radiated field enters the system directly. Experiments show that when the field strength reaches 5V/m, the system will definitely make mistakes. Electromagnetic interference is enough to change the value of the CPU program counter PC, causing the microcomputer to "jump out" of the executing program by mistake, especially for small-signal circuits. The memory cannot work normally when the field strength is 15V/m. Another way of radio frequency interference is introduced through the power supply. The transmission line on the outer frame is equivalent to the receiving antenna, which introduces radiation interference into the system, which can burn the power supply of the system itself when the interference is severe.
Electronic equipment is often subjected to environmental shocks and vibrations during normal use and testing. When the mechanical stress caused by the generated deflection exceeds the allowable working stress of the component parts, this environment can cause physical damage to the components and structural parts. As one of the most famous flexible LED screen manufacturers, Aulice can provide custom LED screens. Contact us if you are interested.
Regardless of whether it is an integrated chip, an LED tube or a switching power supply, whether it is working under a rated load or not, the load is also an important factor affecting the service life. That's because any component has a fatigue damage period, take the power supply as an example: the brand power supply can output 105% to 135% of the power. However, if the power supply is operated under such a high load for a long time, it will inevitably accelerate the ageing of the switching power supply. Of course, the switching power supply does not necessarily fail immediately, but it will quickly reduce its service life.